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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/29 www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 serial eeprom series automotive eeprom 125 operation microwire bus eeprom (3-wire) br93h86-2c general ? description br93h86-2c is a serial eeprom of serial 3-line interface method. features ? conforming to microwire bus ? withstands electrostatic voltage up to 6kv (hbm method typ ? wide temperature range -40 to +125 ? same package line-up and same pin configuration ? 2.5v to 5.5v single supply voltage operation ? address auto increment function at read operation ? prevention of write mistake ? write prohibition at power on ? write prohibition by command code ? write mistake prevention circuit at low voltage ? self-timed programming cycle ? program condition display by ready / busy ? low supply current ? write operation (5v) : 0.8ma (typ) ? read operation (5v) : 0.5ma (typ) ? standby operation (5v) : 0.1 a (typ) ? compact package msop8 / tssop-b8 / sop8 / sop-j8 ? high reliability using rohm original double-cell structure ? more than 50 years data retention (ta Q 125 ) ? more than 300,000 write cycles (ta Q 125 ) ? data set to ffffh on all addresses at shipment ? aec-q100 qualified package (typ) (typ) (max) msop8 2.90mm x 4.00mm x 0.90mm tssop-b8 3.00mm x 6.40mm x 1.20mm sop8 5.00mm x 6.20mm x 1.71mm sop-j8 4.90mm x 6.00mm x 1.65mm br93h86-2c package type msop8 tssop-b8 sop8 sop-j8 capacity bit format product name supply voltage rfvm rfvt rf rfj 16kbit 1k 16 br93h86-2c 2.5v to 5.5v sop8 sop-j8 msop8 tssop-b8
br93h86-2c 2/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 absolute maximum ratings (ta=25 ) parameter symbol limit unit supply voltage v cc -0.3 to +6.5 v permissible dissipation pd 380 (msop8) (1) mw 410 (tssop-b8) (2) 560 (sop8) (3) 560 (sop-j8) (4) storage temperature range tstg -65 to +150 operating temperature ra nge topr -40 to +125 input voltage/output voltage \ -0.3 to vcc+0.3 v when using at ta=25 or higher, 3.1mw(*1), 3.3mw(*2) , 4.5mw(*3,*4),to be reduced per 1 . memory cell characteristics (v cc =2.5v to 5.5v) parameter limit unit conditions min typ max write cycles (5) 1,000,000 - - cycles ta Q 85 500,000 - - cycles ta Q 105 300,000 - - cycles ta Q 125 data retention (5) 100 - - years ta Q 25 60 - - years ta Q 105 50 - - years ta Q 125 (5) not 100% tested recommended operating conditions parameter symbol limit unit supply voltage v cc 2.5 to 5.5 v input voltage v in 0 to v cc
br93h86-2c 3/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 dc characteristics (unless otherwise specified, ta=-40 to +125 , v cc =2.5v to 5.5v) parameter symbol limit unit conditions min typ max input low voltage v il -0.3 - 0.3xv cc v input high voltage v ih 0.7xv cc - v cc +0.3 v output low voltage 1 v ol1 0 - 0.4 v i ol =2.1ma, 4.0v Q v cc Q 5.5v output low voltage 2 v ol2 0 - 0.2 v i ol =100 a output high voltage 1 v oh1 2.4 - v cc v i oh =-0.4ma, 4.0v Q v cc Q 5.5v output high voltage 2 v oh2 v cc -0.2 - v cc v i oh =-100 a input leak current i li -10 - 10 a v in =0v to v cc output leak current i lo -10 - 10 a v out =0v to v cc , cs=0v supply current i cc1 - - 3.0 ma f sk =2mhz, t e/w =4ms (write) i cc2 - - 1.5 ma f sk =2mhz (read) i cc3 - - 3.0 ma f sk =2mhz, t e/w =4ms (wral) standby current i sb - - 10 a c s =0v, do=open radiation resistance design is not made. ac characteristics (unless otherwise specified, ta=-40 to +125 , v cc =2.5v to 5.5v) parameter symbol min typ max unit sk frequency f sk - - 2 mhz sk ?h? time t skh 200 - - ns sk ?l? time t skl 200 - - ns cs ?l? time t cs 200 - - ns cs setup time t css 50 - - ns di setup time t dis 50 - - ns cs hold time t csh 0 - - ns di hold time t dih 50 - - ns data ?1? output delay time t pd1 - - 200 ns data ?0? output delay time t pd0 - - 200 ns time from cs to output establishment t sv - - 150 ns time from cs to high-z t df - - 150 ns write cycle time t e/w - - 4 ms
br93h86-2c 4/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 serial input / output timing data is taken from di, in sync with the rise of sk. at read command, data is outputted from do in sync with the rise of sk. after write command input, the status signal of write (ready / busy) can be monitored from do by setting cs to ?h? after tcs, from the fall of cs, and will display a valid stat us until the next command start bit is inputted. but, if cs is set to ?l?, do sets to high-z state. to execute a series of commands, cs is set to ?l? once af ter completion of each command for internal circuit reset block diagram figure 1 serial input / output timing diagram figure 2 block diagram command decode control clock generation power source voltage detection write prohibition high voltage occurrence command register address buffer sk di dummy bit do data register r/w amplifier 16bit 16bit 16,384 bit eeprom cs address decoder 10bit 10bit tcss cs sk tdf tskh tskl tcsh status valid di do (read) do (write) tdih tdis tpd0 tpd1
br93h86-2c 5/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 pin configuration top view vcc nc nc gnd pin descriptions figure 3 pin configuration pin number pin name i / o function 1 cs input chip select input 2 sk input serial clock input 3 di input start bit, ope code, address, and serial data input 4 do output serial data output, ready / busy status output 5 gnd - ground, 0v 6,7 nc - non connected terminal, vcc, gnd or open 8 vcc - power supply, 2.5v to 5.5v 8 7 6 5 1 2 3 4 cs sk di do br93h86rfvm-2c:msop8 br93h86rfvt-2c :tssop-b8 br93h86rf-2c :sop8 br93h86rfj-2c :sop-j8
br93h86-2c 6/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 typical performance curves 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 23 456 supply voltage : vcc v input high voltage :vih v spec ta= -40 ta= 25 ta= 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 23 456 supply voltage : vcc v input low voltage : vil v spec ta= -40 ta= 25 ta= 125 0.0 0.2 0.4 0.6 0.8 1.0 012345 output low current : iol ma output low voltage : vol v spec ta= -40 ta= 25 ta= 125 0.0 0.2 0.4 0.6 0.8 1.0 012345 output low current : iol ma output low voltage : vol v spec ta= -40 ta= 25 ta= 125 figure 4 input high voltage (cs,sk,di) vs. supply voltage figure 5 input low voltage (cs,sk,di) vs. supply voltage figure 6 output low voltage vs. output low current (v cc =2.5v) figure 7 output low voltage vs. output low current (v cc =4.0v)
br93h86-2c 7/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 typical performance curves \ continued 0.0 1.0 2.0 3.0 4.0 5.0 0 0.4 0.8 1.2 1.6 output high current : ioh ma output high voltage : voh v spec ta= -40 ta= 25 ta= 125 0.0 1.0 2.0 3.0 4.0 5.0 0 0.4 0.8 1.2 1.6 output high current : ioh ma output high voltage : voh v spec ta= -40 ta= 25 ta= 125 0 2 4 6 8 10 12 23456 supply voltage : vcc v input leakage current : ili a spec ta= -40 ta= 25 ta= 125 0 2 4 6 8 10 12 23456 supply voltage : vcc v output leakage current : ilo a spec ta= -40 ta= 25 ta= 125 figure 8 output high voltage vs. output high current (v cc =2.5v) figure 9 output high voltage vs. output high current (v cc =4.0v) figure 10 input leak current (cs,sk,di) vs. supply voltage figure 11 output leak current (do) vs. supply voltage
br93h86-2c 8/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 typical performance curves \ continued figure 12 supply current at write operation vs. supply voltage (write, f sk =2.0mhz) figure 13 supply current at read operation vs. supply voltage (read, f sk =2.0mhz) figure 15 standby current vs. supply voltage figure 14 supply current at wral operation vs. supply voltage (wral, f sk =2.0mhz) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 23 456 supply voltage : vcc v supply current at write : icc1(write) ma spec ta= -40 ta= 25 ta= 125 0.0 0.4 0.8 1.2 1.6 23 456 supply voltage : vcc v current consumption at read : icc2(read) ma spec ta= -40 ta= 25 ta= 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 23 456 supply voltage : vcc v current consumption at wral : icc3(wral) ma spec ta= -40 ta= 25 ta= 125 0 2 4 6 8 10 12 23456 supply voltage : vcc v standby current : isb a spec ta= -40 ta= 25 ta= 125
br93h86-2c 9/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 typical performance curves \ continued 0 4 8 12 16 20 24 28 23456 supply voltage : vcc v sk frequency : fsk mhz spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 23456 supply voltage : vcc v sk high time : tskh ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 23456 supply voltage : vcc v sk low time : tskl ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 23456 supply voltage : vcc v cs low time : tcs ns spec ta= -40 ta= 25 ta= 125 figure 16 sk frequency vs. supply voltage figure 17 sk high time vs. supply voltage figure 18 sk low time vs. supply voltage figure 19 cs low time vs. supply voltage
br93h86-2c 10/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 typical performance curves \ continued 0 20 40 60 80 100 120 23456 supply voltage : vcc v cs setup time : tcss ns spec ta= -40 ta= 25 ta= 125 0 20 40 60 80 100 120 23456 supply voltage : vcc v di setup time : tdis ns spec ta= -40 ta= 25 ta= 125 0 20 40 60 80 100 120 23456 supply voltage : vcc v di hold time : tdih ns spec ta= -40 ta= 25 ta= 125 -450 -400 -350 -300 -250 -200 -150 -100 -50 0 50 23 456 supply voltage : vcc v cs hold time : tcsh ns spec ta= -40 ta= 25 ta= 125 figure 20 cs setup time vs. supply voltage figure 21 di setup time vs. supply voltage figure 22 di hold time vs. supply voltage figure 23 cs hold time vs. supply voltage
br93h86-2c 11/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 typical performance curves \ continued 0 50 100 150 200 250 300 350 23456 supply voltage : vcc v data "1" output delay time : tpd1 ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 350 23456 supply voltage : vcc v data "0" output delay time : tpd0 ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 23456 supply voltage : vcc v time between cs and output : tsv ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 23456 supply voltage : vcc v time between cs and output high-z :tdf ns spec ta= -40 ta= 25 ta= 125 figure 25 data "0" output delay time vs. supply voltage figure 24 data "1" output delay time vs. supply voltage figure 27 time between cs output high-z vs. supply voltage figure 26 time between cs and output vs. supply voltage
br93h86-2c 12/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 figure 28 write cycle time vs. supply voltage 0 1 2 3 4 5 6 23456 supply voltage : vcc v write cycle time : te/w ms spec ta= -40 ta= 25 ta= 125 typical performance curves \ continued
br93h86-2c 13/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 description of operation communications of the microwire bus are carried out by sk (seria l clock), di (serial data input), do (serial data output) ,and cs (chip select) for device selection. in connecting one eeprom to a microcontroller, connect it as show n in figure 29-(a) or figure 29-(b). and, when using the input and output common i/o port of the microc ontroller, connect di and do via a resistor as shown in figure 29-(b) (refer to pages 19/29), wherein connection by 3 lines is possible. in case of using multiple eeprom devices, refer to figure 29-(c). communications of the microwire bus are started by the first ?1? input after the rise of cs. this input is called the ?start bi t?. after input of the start bit, the ?ope code?, address, and data are then inputted consecutively. address and data are all inputted with msb first. all ?0? signal inputs after the rise of cs up to the start bit is ignored. therefore, if there is a limitat ion in the bit width of pic of the microcontroller, it is possible to input ?0 ? before the start bit to control the bit width. command mode command start bit ope code address data br93h86-2c read (read) (1) 1 10 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 d15 to d0(read data) write enable (wen) 1 00 1 1 - write (write) (2) 1 01 a9,a8,a7,a6,a5,a4,a3,a2,a1,a0 d15 to d0(write data) write all (wral) (2,3) 1 00 0 1 b2,b1,b0 d15 to d0(write data) write disable (wds) 1 00 0 0 - ? input the address and the data in msb-first order. ? as for *, input either vih or vil. *start bit acceptance of all the commands of this ic starts at recognition of the start bit. the ?start bit? means the first ?1? input after the rise of cs. (1) for read, after setting the command, th e data output of the selected address star ts. then, in a sequential order of addre sses, the data of the next address will be outputted , and will continuousl y output data of succeeding addresses with the use of a co ntinuous sk clock input. (auto-increment function) (2) when the write and the write-all commands are executed, the previous data written in the selected memory cell are automati cally deleted first, then the input data is written next. (3) for the write all command, data written in memory cell of the areas designated by b2, b1, and b0 are automatically deleted , and input data is written in bulk. write all area figure 29 connection methods with microcontroller figure 29-(a). connection by 4 lines cs sk do di cs sk do cs sk di do figure 29-(b). connection by 3 lines cs sk di do cs3 cs1 cs0 sk do di figure 29-(c). connection example of multiple devices micro- controller br93h86 micro- controller br93h86 micro- controller b2 b1 b0 write area 0 0 0 000h to 07fh 0 0 1 080h to 0ffh 0 1 0 100h to 17fh 0 1 1 180h to 1ffh 1 0 0 200h to 27fh 1 0 1 280h to 2ffh 1 1 0 300h to 37fh 1 1 1 380h to 3ffh cs sk di do device 1 cs sk di do device 2 cs sk di do device 3 ? the write all command is written in bulk in 2kbit unit. the write area can be selected up to 3bit. confirm on the left side the settings and write areas of b2, b1, and b0.
br93h86-2c 14/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 timing chart 1) read cycle (read) (1) start bit when data ?1? is input for the first time after the rise of cs , this will be recognized as the start bit. and, even if multiple ?0? are input after the rise of cs, the first ?1? input will still be recognized as the start bit, and th e following operation starts. this is common to all the comman ds that will be discussed hereafter . when the read command is recognized, the data (16bit) of the selected address is output to serial. a nd at that moment, ?0? (dummy bit) is output first, in sync with address bit a0 an d with the rise of sk. afterwhich, the main data is output in sync with the rise of sk. this ic has address auto increment function availabl e only for read command. wherein after executing read command on the first selected address, the data of the next address is read. and this will continue in a sequential order of addresses with the use of a continuous sk cl ock input, and by keeping cs at ?h? during auto-increment. 2) write cycle (write) in this command, input 16-bit data (d15 to d0) are written to a designated address (a9 to a0). the actual write starts from the fall of cs, after d0 is sampled with sk clock (29 th clock from the start bit input), to the rise of the 30 th clock. when status is not detected (cs="l" fixed), writ e time is 4ms (max) in conformity with t e/w . and when status is detected (cs="h"), all commands are not accepted for areas where "l" (busy) is output from d0. therefore, do not input any command. write is not made or canceled if cs st arts to fall after the rise of the 30 th clock. note: take tskh or more from the rise of the 29th clock to the fall of cs. 3) write all cycle (wral) in this command, input 16-bit data is written simultaneously to designated block for 128 words. data is written in bulk at a write time of only 4ms (max) in conformity with te/w. when writing data to all addresses, designate each block by b2, b1, and b0, and execute write. write time is max.4ms. the actual write starts from the fall of cs, after d0 is sampled with sk clock (29 th clock from the start bit input), to the rise of the 30 th clock. if cs was ended after the rise of the 30 th clock, command is canc eled, and write is not completed. note: take tskh or more from the rise of the 29th clock to the fall of cs. cs 1 2 1 4 high-z 1 a 9 a 1 a 0 0 d15 d14 d1 d15 d14 *1 *2 d0 sk di do 0 t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > 29 30 0 3 5 tcs high-z b1 ready busy te/w do 0d0 cs sk di 12 01 5m status n d1 b0 d15 1b2 0 tsv figure 32 write all cycle figure 31 write cycle figure 30 read cycle tcs high-z ready busy te/w cs sk di do 12 4 a1 a0 0 status n d0 d1 d15 d14 1am 1 i? i? tsv i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? i? 5 3 0 0 3 4 9 29 29 11 (2) the succeeding address? data output auto-increment function i? i?
br93h86-2c 15/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 4) write enable (wen) / disable (wds) cycle at power on, this ic is in write disable status by the inte rnal reset circuit. before exec uting the write command, it is necessary to execute the write enable command first. and, once this command is executed, writing is valid until the write disable command is executed or the power is turned off. however, the read command is valid regardless of whether write enable / disable command is executed. input to sk after 6 clocks of this command is available by either ?h? or ?l?, but be sure to input it. when the write enable command is executed after power on, write enable status gets in. when the write disable command is executed then, the ic gets in write disable st atus as same as at powe r on, and then the write command is canceled thereafter in software manner. however, the r ead command is still executable. in write enable status, even when the write command is input by mistake, writing will st ill continue. to prevent such a mistake, it is recommended to execute the write disable command after the completion of each write execution. application 1) method to cancel each command read write, wral figure 34 read cancel available timing figure 35 write, wral cancel available timing a from start bit to 29 th clock rise cancel by cs=?l? b 29 th clock rise and after cancellation is not available by any m eans. if vcc is turned off in this area, designated address data is not guaranteed, therefore write once again. c 30 th clock rise and after cancel by cs=?l? however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is input continuously, cancellation is not available. start bit ope code address data 1bit 2bit 10bit 16bit cancel is available in all areas in read mode. method to cancel cancel by cs = l start bit ope code address data te/w a 1bit 2bit 10bit 16bit c b sk ? rise of 29 th clock d1 enlarged figure d0 di 28 29 30 31 a b c note 1) if vcc is turned off in this area, designated address data is not guaranteed, therefore, it is recommended to execute write once again. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes unstable. therefore, it is recommended to set cs to ?l? in sk=?l? area. as for sk rise, recommend timing is tcss/tcsh or higher. cs 1 2 1 5 high-z 0 0 sk di do 13 3 4 6 7 8 enable=1 1 disable=0 0 t? > t? > t? > t? > t? > t? > t? > t? > figure 33 write enable (wen) / disable (wds) cycle
br93h86-2c 16/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 2) i/o equivalent circuit output circuit input circuit do oeint. cs reset int. csint. figure 36 output circuit (do) figure 39 input circuit (di) figure 37 input circuit (cs) figure 38 input circuit (sk) sk en skint. di en diint.
br93h86-2c 17/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 cs sk di do d0 bus y read y high-z enlarged cs sk di do bus y high-z improvement by do pull up bus y read y cs=sk=di=?h? when do=open cs=sk=di=?h? when do=pull up do ?h? 3) i/o peripheral circuit 3-1) pull down cs by making cs=?l? at power on/off, mistake in operation and mistake write are prevented. pull down resistance rpd of cs pin to prevent mistake in operation and mistake write at power on/off, a cs pull down resistor is necessary. select an appropriate resistance value from microcontroller?s v oh , i oh and this ic?s v ih characteristics. 3-2) do is available for both pull up and pull down. do output is ?high-z? exce pt during ready / busy output timing in wr ite command and, after data output at read command. when malfunction occurs at ?high- z? input of the microcontro ller port connected to do, it is necessary to pull down and pull up do. when there is no influence upon the micr ocontroller actions, do may be left open. if do is open during a transition of output from busy to ready status, and at an instance where cs=?h?, sk=?h?, di=?h?, eeprom recognizes this as a start bit, resets ready outpu t, and sets do=?high-z?. therefore, ready signal cannot be detected. to avoid such output, pull up do pin for improvement. figure 40 cs pull down resistance microcontroller vohm ?h? output iohm rpd vihe ?l? input eeprom r pd R ??? v ohm i ohm v ohm R v ihe ??? 4.0 2 10 -3 r pd R 2.0 [k ] r pd R example) when v cc =5v, v ihe =3.5v, v ohm =4.0v, i ohm =2ma, from equation , with the value of r pd to satisfying the equation above, v ohm becomes 4.0v or higher, and with v ihe (=3.5v), equation is also satisfied. : eeprom v ih specifications : microcontroller v oh specifications : microcontroller i oh specifications ? v ihe ? v ohm ? i ohm figure 41 ready output timing at do=open
br93h86-2c 18/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 cs high-z sk di do clock write instruction ready busy status tsv pull-up resistance r pu and pull down resistance rpd of do pin as for pull-up and pull-down resistance value, select an appropr iate value to this resistance value from microcontroller v ih , v il , and v oh , i oh , v ol , i ol characteristics of this ic. ready / busy status dis play (do terminal) this display outputs the internal status si gnal. when cs is started after tcs (min.200ns) from cs fall after write command input, ?h? or ?l? output. r/b display ?l? (busy) = write under execution after the timer circuit in the ic works and creates the period of t e/w , this time circuit co mpletes automatically. and write to the memory cell is made in the period of t e/w , and during this period, other command is not accepted. r/b display = ?h? (ready) = command wait status even after t e/w (max.4ms) from write of the memory ce ll, the following command is accepted. therefore, cs=?h? in the period of t e/w , and when input is in sk, di, malfunction may occur. therefore, set di=?l? in the area cs=?h?. (especially, in the case of shared input port, attention is required.) *do not input any command while status signal is output. command i nput in busy area is canceled, but command input in ready are a is accepted. therefore, status ready output is canceled, and malfunction and mistake write may be made. figure 44. r/b status output timing chart figure 42 do pull up resistance figure 43 do pull down resistance microcontroller vilm ?l? input iole vole ?l? output eeprom rpu r pu R ??? v ole Q v ilm ??? 5 0.4 2.1 10 -3 r pu R 2.2 [k ] r pu R example) when v cc =5v , v ole =0.4v, i ole =2.1ma, v ilm =0.8v, from the equation , v cc v ole i ole with the value of r pu to satisfy the above equation, v ole becomes 0.4v or below, and with v ilm (=0.8v), the equation is also satisfied. microcontroller vihm ?h? input iohe vohe ?h? output eeprom rpd r pd R 48 [k ] v ohe R v ihm ??? 5 0.2 0.1 10 -3 r pd R example) when v cc =5v , v ohe =4.8v, i ohe =0.1ma, v ihm =3.5v from the equation r pd R ??? v ohe i ohe with the value of r pd to satisfy the above equation, v ohe becomes 4.8v or below, and with v ihm (=3.5v), the equation is also satisfied. : eeprom v ol specifications : eeprom i ol specifications : microcontroller v il specifications ? v ole ? i ole ? v ilm : eeprom v oh specifications : eeprom i oh specifications : microcontroller v ih specifications ? v ohe ? i ohe ? v ihm do status do status
br93h86-2c 19/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 4) when to directly connect di and do this ic has independent input terminal di and output terminal do, in wherein signals are handled sparately on timing chart. but by inserting a resistance r between these di and do terminals, it is possible to carry out control by only 1 control line. data collision of microcontroller di/o output and do output and feedback of do output to di input. drive from the microcontroller di/o out put to di input on i/o timing, and signal output from do output occur at the same time in the following points. 4-1) 1 clock cycle to take in a0 address data at read command dummy bit ?0? is output to do terminal. when address data a0 = ?1? input, through current route occurs. 4-2) timing of cs = ?h? after write command. do terminal in ready / busy function output. when the next start bit input is recognized, ?high-z? gets in. especially, at command input after write, when cs in put is started with microcontroller di/o output ?l?, ready output ?h? is output from do te rminal, and through current route occurs. feedback input at timing of these 4-1) and 4-2) does not cause disorder in basic operations, if resistance r is inserted. microcontroller di/o port di eeprom do r figure 45 di, do control line common connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port a1 high-z collision of di input and do output ?h? a0 0 d15 d14 d13 a1 a0 high-z microcontroller output microcontroller input figure 46. collision timing at read data output at di, do direct connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port write command microcontroller output busy busy ready ready ready collision of di input and do output t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > t? > high-z write command write command write command write command microcontroller input microcontroller output figure 47 collision timing at di, do direct connection
br93h86-2c 20/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 selection of resistance value r the resistance r becomes through current limit resistance at data collision. when through current flows, noises of power source line and instantaneous stop of power source ma y occur. when allowable through current is defined as i, the following relation should be satisfied. determine allow able current amount in consideration of impedance and so forth of power source line in set. and insert resistance r, and set the value r to satisfy eeprom input level v ih /v il , even under influence of voltage decline owing to leak current and so forth. insertion of r will not cause any influence upon basic operations. 4-3) address data a0 = ?1? input, dummy bit ?0? output timing (when microcontroller di/o output is ?h?, eeprom do outputs ?l?, and ?h? is input to di) ? make the through current to eeprom 10ma or below. ? see to it that the input level v ih of eeprom should satisfy the following. 4-4) do status ready output timing (when the microcontroller di/o is ?l?, eeprom do outputs ?h?, and ?l? is input to di) ? set the eeprom input level v il so as to satisfy the following. microcontroller di/o port di eeprom do r ?h? output iohm vohm vole ?l? output figure 48 circuit at di, do direct connection (microcontroller di/o ?h? output, eeprom ?l? output) v ohm Q v ihe v ohm Q i ohm r + v ole at this moment, if v ole =0v, v ohm Q i ohm r r R ??? v ohm i ohm : eeprom v ih specifications : eeprom v ol specifications : microcontroller v oh specifications : microcontroller i oh specifications ? v ihe ? v ole ? v ohm ? i ohm microcontroller di/o port di eeprom do r ?l? output iohm volm vohe ?h? output c on di t i on v olm R v ile v olm R v ohe ? i olm r as this moment, if v ohe =v cc , v olm R v cc ? i olm r r R ??? v cc ? v olm i olm figure 49 circuit at di, do direct connection (microcontroller di/o ?l? output, eeprom ?h? output) example) when v cc =5v, v ohm =5v, i ohm =0.4ma, v olm =0.4v, i olm =2.1ma, from the equation , from the equation , r R r R v ohm i ohm 5 0.4 10 -3 r R 12.5 [k ] ??? r R r R v cc ? v olm i olm 5 ? 0.4 2.1 10 -3 r R 2.2 [k ] ??? therefore, from the equations and , r R 12.5 [k ] : eeprom v il specifications : eeprom v oh specifications : microcontroller v ol specifications : microcontroller i ol specifications ? v ile ? v ohe ? v olm ? i olm c on di t i on
br93h86-2c 21/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 5) power-up/down conditions ? at power on/off, set cs ?l?. when cs is ?h?, this ic gets in input accept status (active) . at power on, set cs ?l? to prevent malfunction from noise. (when cs is in ?l? status, all inputs are canceled.) at powe r decline low power status may pr evail. therefor e, at power off, set cs ?l? to prevent malfunction from noise. por circuit this ic has a por (power on reset) circuit as a mistak e write countermeasure. after por action, it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. however, if cs is ?h? at power on/off, it may become write enable status owi ng to noises and the likes. for secure actions, observe the following conditions. 1. set cs=?l? 2. turn on power so as to satisfy the recommended conditions of t r , t off , v bot for p or circuit action. l vcc circuit l vcc (v cc -lockout) circuit prevents data rewrite action at low power, and prevents wrong write. at l vcc voltage (typ=1.9v) or below, it prevents data rewrite. 6) noise countermeasures v cc noise (bypass capacitor) when noise or surge gets in the power source line, malfuncti on may occur. therefore, in removing these, it is recommended to attach a bypass capacitor (0.1 f) between ic v cc and gnd as close to ic as possible. it is also recommended to attach a bypass capacitor between board v cc and gnd. sk noise when the rise time (t r ) of s k is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. to avoid this, a schmitt trigger circuit is built in s k input. the hysteresis width of this circuit is set about 0.2v. if noise exists at s k input, set the noise amplitude 0.2vp-p or below. and it is recommended to set the rise time (t r ) of s k to 100ns or below. in the case when the rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possible. t off t r vbot 0 v cc t r t off vbot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below vcc gnd vcc gnd vcc cs bad example good example figure 50 timing at power on/off figure 51 rise waveform diagram bad example cs pin is pulled up to v cc . in this case, cs becomes ?h? (active status), eeprom may malfunction or have write error due to noises. this is true even when cs input is high-z. good example it is ?l? at power on/off. set 10ms or higher to recharge at power off. when power is turned on without observing this condition, ic internal ci rcuit may not be reset. recommended conditions of tr, toff, vbot
br93h86-2c 22/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 operational notes (1) described numeric values and data are design repr esentative values, and the values are not guaranteed. (2) application circuit although we can recommend the application circuits contained herein with a relatively high degree of confidence, we ask that you verify all characteristics and specifications of the circuit as well as its performance under actual conditions. please note that we cannot be held responsible for probl ems that may arise due to patent infringements or noncompliance with any and all applicable laws and regulations. (3) absolute ma ximum ratings operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is im portant to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. (4) ground voltage the voltage of the ground pin must be the lo west voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (5) thermal consideration use a thermal design that allows for a suff icient margin by taking into account t he permissible power dissipation (pd) in actual operating conditions. consi der pc that does not exceed pd in actual operating conditions (pc pd). package power dissipation : pd (w)=(t jmax ta ) / ja power dissipation : pc (w)=(v cc v o) i o +v cc i b tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current (6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards . the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit ma y be caused by conductive particles caught between the pins. (7) operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction.
br93h86-2c 23/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 part numbering b r 9 3 h 8 6 x x x x 2 c x x lineup capacity package orderable part number type quantity 16k msop8 reel of 3000 br93h86rfvm-2ctr tssop-b8 br93h86rfvt-2ce2 sop8 reel of 2500 BR93H86RF-2CE2 sop-j8 br93h86rfj-2ce2 capacity 86 = 16kbit package rfvm rfvt rf rfj package specifications tr reel shape emboss taping (msop8) e2 reel shape emboss taping (tssop-b8, sop8, sop-j8) process code bus type 93: microwire bus operating temperature h: -40 o c to +125 o c : msop8 : tssop-b8 : sop8 : sop-j8
br93h86-2c 24/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 physical dimentions tape and reel infomation (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 5 7 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05 ?0.04 0.6 0.2 0.29 0.15 0.145 +0.05 ?0.03 4 + 6 ? 4 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
br93h86-2c 25/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 (unit : mm) tssop-b8 0.08 s 0.08 m 4 4 234 8765 1 1.0 0.05 1pin mark 0.525 0.245 +0.05 ?0.04 0.65 0.145 +0.05 ?0.03 0.1 0.05 1.2max 3.0 0.1 4.4 0.1 6.4 0.2 0.5 0.15 1.0 0.2 (max 3.35 include burr) s direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin
br93h86-2c 26/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 ? 4 0.17 +0.1 - 0.05 0.595 6 4 3 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s 0.1 s
br93h86-2c 27/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop-j8 4 + 6 ? 4 0.2 0.1 0.45min 234 5 6 7 8 1 4.9 0.2 0.545 3.9 0.2 6.0 0.3 (max 5.25 include burr) 0.42 0.1 1.27 0.175 1.375 0.1 0.1 s s
br93h86-2c 28/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 marking diagrams capacity product name marking package type 16k rh86 msop8 tssop-b8 sop8 sop-j8 msop8 (top view) part number marking lot number 1pin mark tssop-b8 (top view) part number marking lot number 1pin mark sop8 (top view) part number marking lot number 1pin mark sop-j8 (top view) part number marking lot number 1pin mark r h 8 6 r h 8 6 r h 8 6 r h 8 6
br93h86-2c 29/29 datasheet d a t a s h e e t www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100050-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 revision history date revision changes 31.aug.2012 001 new release 19.dec.2012 002 all page document converted to new format. p2 data retention was changed. 16.feb.2016 003 p1 data retention and write cycles were modified. p13 reference page number was modified. p14 comment in wral was modified. p14 figure 31. was modified. p18 text bug was modified in figure 42..
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
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